Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, ...

Several critical decisions go into the thinning and processing of thin device wafers. Which temporary bonding adhesive is most compatible with the process flow? Can it fix the thin wafer in place ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

The Global Market for Hybrid Bonding Technology was valued at USD 164 Million in the year 2024 and is projected to reach a revised size of USD 756 Million by 2031, growing at a CAGR of 24.7% during ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...