The field of AI is notoriously filled with jargon. To better understand what is going on, here is a series of explainers, ...

which then connects to a GPU, CPU, TPU, or SoC die. The entire stack sits on an interposer atop a package substrate, similar to the packaging design used in HBM. HBF isn’t a straight drop-in ...

Google has unveiled a new AI processor, the seventh generation of its custom TPU architecture. The chip, known as Ironwood, ...

These are full racks that are fully integrated using high-speed NVLink interconnects such that the entire rack can be treated as a single GPU ... Arm-based datacenter CPU. Each Blackwell Superchip ...