including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs ...

According to a new comprehensive report from The Insight Partners, the rising consumer electronics industry is a significant ...

considering packaging and system-level needs. With expertise in microelectronics, micro-electromechanical systems (MEMS), and photonics, Fraunhofer IMS focuses on post-CMOS integration of PICs for ...

Several 3D packages, such as System in Package and Chip Stack MCM, are available in the market providing smaller form factor and greater connectivity. The stacked chips are wired together along their ...

According to a report by Patently Apple, the H5EA1A56MWA chip uses a 1Ynm CMOS process with six metal ... Nexperia's 4-bit dual power buffer, SiTime's MEMS oscillator, Texas Instruments' single ...

Today, the company announced the signing signed a definitive agreement to acquire certain assets of Knowles Corporation’s Consumer MEMS Microphones (CMM) business. Knowles’ CMM division ...

IRVINE, Calif., Sept. 19, 2024 (GLOBE NEWSWIRE) -- Syntiant Corp., the recognized leader in low power edge AI deployments, today announced it has signed a definitive agreement to acquire certain ...