Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Highlights,Micron Technology begins construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in ...

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new ...

PRNewswire San Jose California [US] January 10 Supermicro Inc NASDAQ SMCI a Total IT Solution Provider for AIML HPC Cloud ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...

Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...

Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...

Intel, STMicroelectronics, Texas Instruments, NVIDIA and SUMCO are part of the Zacks Industry Outlook article.

Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even ...

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center ...

Nvidia’s CEO Jensen Huang expressed confidence that Samsung will overcome challenges in producing high-bandwidth memory chips ...