According to a new comprehensive report from The Insight Partners, the rising consumer electronics industry is a significant ...

Several 3D packages, such as System in Package and Chip Stack MCM, are available in the market providing smaller form factor and greater connectivity. The stacked chips are wired together along their ...

The course gives an introduction to CMOS image sensor chips used in digital cameras. The entire signal chain from light to jpeg compressed image will be covered, incl. pixels and readout circuits, A/D ...

Inertial MEMS technology is ushering in a new era of vibration monitoring and is enabling a wider user base for this type of instrumentation. Performance, packaging, and familiarity may contribute to ...