Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Pure play semiconductor foundry GlobalFoundries (GF) said it will create a new center for advanced packaging and testing of U.S.-made essential chips at its New York manufacturing facility.

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.

GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA.

The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...

GlobalFoundries has unveiled plans to invest US$575 million in a cutting-edge advanced packaging and photonics center at its ...

The Indian Institute of Packaging (IIP) and Ukhi, a provider of sustainable solutions, have signed a memorandum of ...

TSMC to increase capex by 34%, driven by AI spends and N2 node ramp. Peak margins expected, but structural improvements may ...

The new 300,000-square-foot facility is part of the company’s efforts to enhance semiconductor logistics and manufacturing ...

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

GlobalFoundries invests $575 million in a new packaging and photonics center in Malta, NY, creating over 100 jobs.