From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer processes.

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

Power mosfet and wafer-maker IceMos Technology has pulled-in $22m of series-E funding, including $7.5m from 57 Stars, and ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.